Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

10.1016/S0921-5107(00)00544-4

Saved in:
Bibliographic Details
Main Authors: Latt, K.M., Lee, K., Osipowicz, T., Lee, Y.K.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Diffusion barrier
Electroplated (EP)
Ionized metal plasma (IMP)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/97626
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Be the first to leave a comment!
You must be logged in first

Similar Items