Design and development of interconnects for ultra-fine pitch wafer level packages

by Tay, A.A.O., Iyer, M.K., Tummala, R.R.
Published 2014

Synthesis and characterization of palladium nanoparticles-corannulene nanocomposite: an anode electrocatalyst for direct oxidation of methanol in alkaline medium

by Bhavani, Kalli Sai, Anusha, Tummala, Stuparu, Mihaiela Corina, Brahman, Pradeep Kumar
Published 2022

Synthesis and characterization of corannulene-metal-organic framework support material for palladium catalyst: an excellent anode material for accelerated methanol oxidation

by Khuntia, Harisankar, Bhavani, Kalli Sai, Anusha, Tummala, Trinadh, Thota, Stuparu, Mihaiela Corina, Brahman, Pradeep Kumar
Published 2022

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

by Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Published 2014

New paradigm in IC-package interconnections by reworkable nano-interconnects

by Aggarwal, A.O., Raj, P.M., Abothu, I.R., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Published 2014

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

by Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Published 2014

Development of stretch solder interconnections for wafer level packaging

by Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Published 2014

Super stretched solder interconnects for wafer level packaging

by Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Published 2014

Single or dual antiplatelet therapy after PCI

by Miyazaki Y., Suwannasom P., Sotomi Y., Abdelghani M., Tummala K., Katagiri Y., Asano T., Tenekecioglu E., Zeng Y., Cavalcante R., Collet C., Onuma Y., Serruys P.
Published 2017

Single or dual antiplatelet therapy after PCI

by Yosuke Miyazaki, Pannipa Suwannasom, Yohei Sotomi, Mohammad Abdelghani, Karthik Tummala, Yuki Katagiri, Taku Asano, Erhan Tenekecioglu, Yaping Zeng, Rafael Cavalcante, Carlos Collet, Yoshinobu Onuma, Patrick W. Serruys
Published 2018

Single or dual antiplatelet therapy after PCI

by Yosuke Miyazaki, Pannipa Suwannasom, Yohei Sotomi, Mohammad Abdelghani, Karthik Tummala, Yuki Katagiri, Taku Asano, Erhan Tenekecioglu, Yaping Zeng, Rafael Cavalcante, Carlos Collet, Yoshinobu Onuma, Patrick W. Serruys
Published 2018

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

by Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
Published 2014

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

by Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
Published 2014

Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

by Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
Published 2014

Assessment of recent process analytical technology (PAT) trends: A multiauthor review

by Simon L.L, Pataki H, Marosi G, Meemken F, Hungerbuhler K, Baiker A, Tummala S, Glennon B, Kuentz M, Steele G, Kramer H.J.M, Rydzak J.W, Chen Z, Morris J, Kjell F, Singh R, Gani R, Gernaey K.V, Louhi-Kultanen M, Oreilly J, Sandler N, Antikainen O, Yliruusi J, Frohberg P, Ulrich J, Braatz R.D, Leyssens T, Von Stosch M, Oliveira R, Tan R.B.H, Wu H, Khan M, Ogrady D, Pandey A, Westra R, Delle-Case E, Pape D, Angelosante D, Maret Y, Steiger O, Lenner M, Abbou-Oucherif K, Nagy Z.K, Litster J.D, Kamaraju V.K, Chiu M.-S
Published 2016