Copper diffusion barrier performance of amorphous Ta-Ni thin films

• المؤلفون الرئيسيون: Yan, Hua, Tay, Yee Yan, Jiang, Yueyue, Yantara, Natalia, Pan, Jisheng, Liang, Meng Heng, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/100648; http://hdl.handle.net/10220/11040
• المؤسسة: Nanyang Technological University

Amorphous Ta–Ni thin films were deposited on Si substrate by magnetron sputtering. The oxygen concentration was adjusted by controlling the substrate bias during the sputtering deposition. Two types of Ta–Ni films, namely Ta67.34Ni27.06O5.60 and Ta73.25Ni26.10O0.65 were employed in the current study...