Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength

This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.

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Bibliographic Details
Main Author:	Kithva Prakash Hariram.
Other Authors:	Sritharan, Thirumany
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	http://hdl.handle.net/10356/5064
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5064
record_format	dspace
spelling	sg-ntu-dr.10356-50642020-06-01T11:56:51Z Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength Kithva Prakash Hariram. Sritharan, Thirumany School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints. Doctor of Philosophy (SME) 2008-09-17T10:18:59Z 2008-09-17T10:18:59Z 2003 2003 Thesis http://hdl.handle.net/10356/5064 Nanyang Technological University 216 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Kithva Prakash Hariram. Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
description	This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.
author2	Sritharan, Thirumany
author_facet	Sritharan, Thirumany Kithva Prakash Hariram.
format	Theses and Dissertations
author	Kithva Prakash Hariram.
author_sort	Kithva Prakash Hariram.
title	Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
title_short	Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
title_full	Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
title_fullStr	Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
title_full_unstemmed	Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
title_sort	intermetallic formation and growth at the interface between copper and sn-pb solders and its effects on joint strength
publishDate	2008
url	http://hdl.handle.net/10356/5064
_version_	1681059119441641472

Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength

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