Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength

• Main Author: Kithva Prakash Hariram.
• Other Authors: Sritharan, Thirumany
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/5064
• Institution: Nanyang Technological University

This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.