Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5064 |
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| Institution: | Nanyang Technological University |