Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength

Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength

This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.

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Bibliographic Details
Main Author: Kithva Prakash Hariram.
Other Authors: Sritharan, Thirumany
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:http://hdl.handle.net/10356/5064
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Institution: Nanyang Technological University

Internet

http://hdl.handle.net/10356/5064

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