Mechanics of materials characterization of lead-free solders
Lead-free solders will replace tin-lead solders in electronic products due to European Union laws to restrict the use of toxic materials like lead (Pb) in electronic equipment by July 1st, 2006. Legislation to ban the use of lead (Pb) is forcing the electronic industry to use lead-free solders. Sold...
Saved in:
Main Author: | Xiong, Bingshou |
---|---|
Other Authors: | Pang Hock Lye, John |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/5423 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Study on the interconnection failure in lead-free soldered assemblies
by: Xu, Luhua
Published: (2008) -
Lead free solder materials study
by: Nash Hairie Rosly
Published: (2020) -
Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
by: Periannan Arulvanan.
Published: (2008) -
Characterization of lead free solder joints in microelectronics assemblies
by: Hla Phone Maw.
Published: (2010) -
Study of microstructures and mechanical properties of lead-free solder joints
by: Ngoh, Shwu Lan
Published: (2010)