Warpage study of plastic endapsulated IC package
This project is to study and optimize the warpage of IC packages using statistical analysis. Design of Experiment is used and experiments are carried out to identify the factors that have significant effect on the warpage of packages. The factors to be studied are chip/pad ratio, pad size, downset,...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5726 |
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| Institution: | Nanyang Technological University |