Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate were investigated for three different Ni–P thicknesses. It was found that during interfacial reactions, Ni3Sn4 intermetallic grows at the Sn–3.5Ag/Ni–P interface along with the crystallizatio...

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Main Authors: Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2013
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Online Access:https://hdl.handle.net/10356/95233
http://hdl.handle.net/10220/9390
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-952332023-07-14T15:57:33Z Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate Kumar, Aditya Chen, Zhong Mhaisalkar, Subodh Gautam Wong, Chee Cheong Teo, Poi Siong Kripesh, Vaidhyanathan School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate were investigated for three different Ni–P thicknesses. It was found that during interfacial reactions, Ni3Sn4 intermetallic grows at the Sn–3.5Ag/Ni–P interface along with the crystallization of electroless Ni–P layer into Ni3P compound. Additional interfacial compounds (IFCs) such as Ni–Sn–P, Cu3Sn, Cu6Sn5, (Ni1−xCux)3Sn4, and (Ni1−xCux)6Sn5 were also found to grow at the Sn–3.5Ag/Ni–P/Cu interfaces depending upon the Ni–P thickness. In the sample with thin Ni–P layer, formation of these IFCs appeared at lower aging temperature and within shorter aging duration than in the samples with thicker Ni–P. The complete dissolution of electroless Ni–P layer into Ni3P and Ni–Sn–P layers was found to be the main cause for the growth of additional IFCs. Across the Ni3P and Ni–Sn–P layers, diffusion of Cu and Sn takes place resulting in the formation of Cu–Sn and Ni–Cu–Sn intermetallics. It is shown in this paper that multi-layered IFC growth at the Sn–3.5Ag/Ni–P/Cu interfaces can be avoided by the selection of proper Ni–P thickness. Accepted version 2013-03-13T01:25:14Z 2019-12-06T19:10:55Z 2013-03-13T01:25:14Z 2019-12-06T19:10:55Z 2005 2005 Journal Article Kumar, A., Chen, Z., Mhaisalkar, S. G. , Wong, C. C., Teo, P. S., & Kripesh, V. (2005). Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate. Thin Solid Films, 504(1-2), 410-415. 0040-6090 https://hdl.handle.net/10356/95233 http://hdl.handle.net/10220/9390 10.1016/j.tsf.2005.09.059 en Thin solid films © 2005 Elsevier B.V. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier B.V. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.tsf.2005.09.059]. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Kumar, Aditya
Chen, Zhong
Mhaisalkar, Subodh Gautam
Wong, Chee Cheong
Teo, Poi Siong
Kripesh, Vaidhyanathan
Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
description Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate were investigated for three different Ni–P thicknesses. It was found that during interfacial reactions, Ni3Sn4 intermetallic grows at the Sn–3.5Ag/Ni–P interface along with the crystallization of electroless Ni–P layer into Ni3P compound. Additional interfacial compounds (IFCs) such as Ni–Sn–P, Cu3Sn, Cu6Sn5, (Ni1−xCux)3Sn4, and (Ni1−xCux)6Sn5 were also found to grow at the Sn–3.5Ag/Ni–P/Cu interfaces depending upon the Ni–P thickness. In the sample with thin Ni–P layer, formation of these IFCs appeared at lower aging temperature and within shorter aging duration than in the samples with thicker Ni–P. The complete dissolution of electroless Ni–P layer into Ni3P and Ni–Sn–P layers was found to be the main cause for the growth of additional IFCs. Across the Ni3P and Ni–Sn–P layers, diffusion of Cu and Sn takes place resulting in the formation of Cu–Sn and Ni–Cu–Sn intermetallics. It is shown in this paper that multi-layered IFC growth at the Sn–3.5Ag/Ni–P/Cu interfaces can be avoided by the selection of proper Ni–P thickness.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Kumar, Aditya
Chen, Zhong
Mhaisalkar, Subodh Gautam
Wong, Chee Cheong
Teo, Poi Siong
Kripesh, Vaidhyanathan
format Article
author Kumar, Aditya
Chen, Zhong
Mhaisalkar, Subodh Gautam
Wong, Chee Cheong
Teo, Poi Siong
Kripesh, Vaidhyanathan
author_sort Kumar, Aditya
title Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
title_short Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
title_full Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
title_fullStr Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
title_full_unstemmed Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
title_sort effect of ni–p thickness on solid-state interfacial reactions between sn–3.5ag solder and electroless ni–p metallization on cu substrate
publishDate 2013
url https://hdl.handle.net/10356/95233
http://hdl.handle.net/10220/9390
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