Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate were investigated for three different Ni–P thicknesses. It was found that during interfacial reactions, Ni3Sn4 intermetallic grows at the Sn–3.5Ag/Ni–P interface along with the crystallizatio...
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Main Authors: | , , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/95233 http://hdl.handle.net/10220/9390 |
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Institution: | Nanyang Technological University |
Language: | English |
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