Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects

International Journal of Nanoscience

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Bibliographic Details
Main Authors:	Zhang, D.H., Yang, L.Y., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Other Authors:	INSTITUTE OF ENGINEERING SCIENCE
Format:	Article
Published:	2014
Subjects:	Cu metallization Tantalum barrier Thermal stability Ultra low k
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/113108
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-113108
record_format	dspace
spelling	sg-nus-scholar.10635-1131082024-11-12T21:16:25Z Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects Zhang, D.H. Yang, L.Y. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D. INSTITUTE OF ENGINEERING SCIENCE PHYSICS Cu metallization Tantalum barrier Thermal stability Ultra low k International Journal of Nanoscience 3 4-5 481-487 2014-11-28T09:12:06Z 2014-11-28T09:12:06Z 2004-08 Article Zhang, D.H.,Yang, L.Y.,Li, C.Y.,Liu, R.,Wee, A.T.S.,Foo, P.D. (2004-08). Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects. International Journal of Nanoscience 3 (4-5) : 481-487. ScholarBank@NUS Repository. 0219581X http://scholarbank.nus.edu.sg/handle/10635/113108 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Cu metallization Tantalum barrier Thermal stability Ultra low k
spellingShingle	Cu metallization Tantalum barrier Thermal stability Ultra low k Zhang, D.H. Yang, L.Y. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D. Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
description	International Journal of Nanoscience
author2	INSTITUTE OF ENGINEERING SCIENCE
author_facet	INSTITUTE OF ENGINEERING SCIENCE Zhang, D.H. Yang, L.Y. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D.
format	Article
author	Zhang, D.H. Yang, L.Y. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D.
author_sort	Zhang, D.H.
title	Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
title_short	Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
title_full	Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
title_fullStr	Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
title_full_unstemmed	Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
title_sort	thermal stability of cu/ta/ultra low k porous polymer structures for multilevel interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/113108
_version_	1821202568518303744

Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects

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