Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects

Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects

International Journal of Nanoscience

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Bibliographic Details
Main Authors: Zhang, D.H., Yang, L.Y., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Article
Published: 2014
Subjects:
Cu metallization
Tantalum barrier
Thermal stability
Ultra low k
Online Access:http://scholarbank.nus.edu.sg/handle/10635/113108
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Institution: National University of Singapore

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