Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

10.1016/j.tsf.2005.09.166

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Bibliographic Details
Main Authors: Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Lu, P.W., Foo, P.D., Wee, A.T.S.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Conference or Workshop Item
Published: 2014
Subjects:
Cu metallization
SiCN
TaN
Ultra low k polymer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/113110
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Institution: National University of Singapore
Description
Summary:10.1016/j.tsf.2005.09.166

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