Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

10.1016/j.tsf.2005.09.166

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Bibliographic Details
Main Authors:	Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Lu, P.W., Foo, P.D., Wee, A.T.S.
Other Authors:	INSTITUTE OF ENGINEERING SCIENCE
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Cu metallization SiCN TaN Ultra low k polymer
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/113110
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-113110
record_format	dspace
spelling	sg-nus-scholar.10635-1131102023-10-26T21:02:14Z Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Lu, P.W. Foo, P.D. Wee, A.T.S. INSTITUTE OF ENGINEERING SCIENCE PHYSICS Cu metallization SiCN TaN Ultra low k polymer 10.1016/j.tsf.2005.09.166 Thin Solid Films 504 1-2 265-268 THSFA 2014-11-28T09:12:08Z 2014-11-28T09:12:08Z 2006-05-10 Conference Paper Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Lu, P.W., Foo, P.D., Wee, A.T.S. (2006-05-10). Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration. Thin Solid Films 504 (1-2) : 265-268. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.166 00406090 http://scholarbank.nus.edu.sg/handle/10635/113110 000236486200063 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Cu metallization SiCN TaN Ultra low k polymer
spellingShingle	Cu metallization SiCN TaN Ultra low k polymer Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Lu, P.W. Foo, P.D. Wee, A.T.S. Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
description	10.1016/j.tsf.2005.09.166
author2	INSTITUTE OF ENGINEERING SCIENCE
author_facet	INSTITUTE OF ENGINEERING SCIENCE Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Lu, P.W. Foo, P.D. Wee, A.T.S.
format	Conference or Workshop Item
author	Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Lu, P.W. Foo, P.D. Wee, A.T.S.
author_sort	Yang, L.Y.
title	Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
title_short	Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
title_full	Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
title_fullStr	Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
title_full_unstemmed	Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
title_sort	comparative investigation of tan and sicn barrier layer for cu/ultra low k integration
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/113110
_version_	1781789168143171584

Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

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