Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

• Main Authors: Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Lu, P.W., Foo, P.D., Wee, A.T.S.
• Other Authors: INSTITUTE OF ENGINEERING SCIENCE
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Cu metallization; SiCN; TaN; Ultra low k polymer
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/113110
• Institution: National University of Singapore

10.1016/j.tsf.2005.09.166