Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

10.1016/j.tsf.2005.09.166

Saved in:
Bibliographic Details
Main Authors: Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Lu, P.W., Foo, P.D., Wee, A.T.S.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Conference or Workshop Item
Published: 2014
Subjects:
TaN
Online Access:http://scholarbank.nus.edu.sg/handle/10635/113110
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items