Investigation of metal-organic chemical vapor deposited copper diffusion in tantalum after annealing

• Main Authors: Loh, S.W., Zhang, D.H., Liu, R., Li, C.Y., Wee, A.T.S.
• 其他作者: INSTITUTE OF ENGINEERING SCIENCE
• 格式: Conference or Workshop Item
• 出版: 2014
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/116746

10.1109/SPI.2002.258308