Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps

Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps

Master's

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書目詳細資料
主要作者:	DAVID ALLEN WONG
其他作者:	SINGAPORE-MIT ALLIANCE
格式:	Theses and Dissertations
出版:	2019
主題:	Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux
在線閱讀:	https://scholarbank.nus.edu.sg/handle/10635/153885
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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