Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

10.1016/j.jallcom.2009.05.136

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Bibliographic Details
Main Authors:	Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Hermeticity In-Sn Intermetallic compound Low-temperature bonding WLP
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/55269
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-55269
record_format	dspace
spelling	sg-nus-scholar.10635-552692023-10-29T22:50:10Z Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization Yu, D.-Q. Lee, C. Yan, L.L. Thew, M.L. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING Hermeticity In-Sn Intermetallic compound Low-temperature bonding WLP 10.1016/j.jallcom.2009.05.136 Journal of Alloys and Compounds 485 1-2 444-450 JALCE 2014-06-17T02:41:09Z 2014-06-17T02:41:09Z 2009-10-19 Article Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H. (2009-10-19). Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization. Journal of Alloys and Compounds 485 (1-2) : 444-450. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jallcom.2009.05.136 09258388 http://scholarbank.nus.edu.sg/handle/10635/55269 000271542900098 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Hermeticity In-Sn Intermetallic compound Low-temperature bonding WLP
spellingShingle	Hermeticity In-Sn Intermetallic compound Low-temperature bonding WLP Yu, D.-Q. Lee, C. Yan, L.L. Thew, M.L. Lau, J.H. Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
description	10.1016/j.jallcom.2009.05.136
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Yu, D.-Q. Lee, C. Yan, L.L. Thew, M.L. Lau, J.H.
format	Article
author	Yu, D.-Q. Lee, C. Yan, L.L. Thew, M.L. Lau, J.H.
author_sort	Yu, D.-Q.
title	Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
title_short	Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
title_full	Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
title_fullStr	Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
title_full_unstemmed	Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
title_sort	characterization and reliability study of low temperature hermetic wafer level bonding using in/sn interlayer and cu/ni/au metallization
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/55269
_version_	1781412100507172864

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

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