Multiplexed MPC for multizone thermal processing in semiconductor manufacturing
10.1109/TCST.2009.2036155
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Main Authors: | Ling, K.V., Ho, W.K., Wu, B.F., Lo, A., Yan, H. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/56730 |
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Institution: | National University of Singapore |
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