Multiplexed MPC for multizone thermal processing in semiconductor manufacturing

10.1109/TCST.2009.2036155

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Bibliographic Details
Main Authors: Ling, K.V., Ho, W.K., Wu, B.F., Lo, A., Yan, H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/56730
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Institution: National University of Singapore

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