Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

• Main Authors: Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
• 其他作者: ELECTRICAL & COMPUTER ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Hermeticity; In-Sn; Microelectromechanical systems (MEMS); Reliability; Wafer bonding; Wafer-level packaging
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/57791

10.1109/TCAPT.2009.2016108