Numerical simulation of delamination in IC packages using a new variable-order singular boundary element

Numerical simulation of delamination in IC packages using a new variable-order singular boundary element

10.1115/1.1604803

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書目詳細資料
Main Authors:	Tay, A.A.O., Lee, K.H., Lim, K.M.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/60942
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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