Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements

Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements

10.1117/12.404874

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Bibliographic Details
Main Authors: Chu, L.W., Pey, K.L., Chim, W.K., Loh, S.K., Er, E.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Electromigration
Interconnects
Low frequency noise
Reliability
Resistance
Voids
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72615
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-726152023-10-30T10:21:10Z Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements Chu, L.W. Pey, K.L. Chim, W.K. Loh, S.K. Er, E. ELECTRICAL ENGINEERING Electromigration Interconnects Low frequency noise Reliability Resistance Voids 10.1117/12.404874 Proceedings of SPIE - The International Society for Optical Engineering 4229 157-167 PSISD 2014-06-19T05:10:02Z 2014-06-19T05:10:02Z 2000 Conference Paper Chu, L.W., Pey, K.L., Chim, W.K., Loh, S.K., Er, E. (2000). Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements. Proceedings of SPIE - The International Society for Optical Engineering 4229 : 157-167. ScholarBank@NUS Repository. https://doi.org/10.1117/12.404874 0277786X http://scholarbank.nus.edu.sg/handle/10635/72615 000167995800022 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Electromigration
Interconnects
Low frequency noise
Reliability
Resistance
Voids
spellingShingle Electromigration
Interconnects
Low frequency noise
Reliability
Resistance
Voids
Chu, L.W.
Pey, K.L.
Chim, W.K.
Loh, S.K.
Er, E.
Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
description 10.1117/12.404874
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Chu, L.W.
Pey, K.L.
Chim, W.K.
Loh, S.K.
Er, E.
format Conference or Workshop Item
author Chu, L.W.
Pey, K.L.
Chim, W.K.
Loh, S.K.
Er, E.
author_sort Chu, L.W.
title Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
title_short Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
title_full Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
title_fullStr Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
title_full_unstemmed Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
title_sort estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/72615
_version_ 1781783264141246464

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