Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements
10.1117/12.404874
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Main Authors: | Chu, L.W., Pey, K.L., Chim, W.K., Loh, S.K., Er, E. |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/72615 |
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Institution: | National University of Singapore |
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