Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

10.1109/EMAP.2008.4784267

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Bibliographic Details
Main Authors: Lee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83520
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Institution: National University of Singapore
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Summary:10.1109/EMAP.2008.4784267

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