Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging
10.1109/EMAP.2008.4784267
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2014
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sg-nus-scholar.10635-835202023-10-26T20:43:44Z Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging Lee, C. Yu, D. Yu, A. Yan, L. Wang, H. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EMAP.2008.4784267 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 216-219 2014-10-07T04:42:09Z 2014-10-07T04:42:09Z 2008 Conference Paper Lee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H. (2008). Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging. 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 : 216-219. ScholarBank@NUS Repository. https://doi.org/10.1109/EMAP.2008.4784267 9781424436217 http://scholarbank.nus.edu.sg/handle/10635/83520 000264237400049 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| description |
10.1109/EMAP.2008.4784267 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Lee, C. Yu, D. Yu, A. Yan, L. Wang, H. Lau, J.H. |
| format |
Conference or Workshop Item |
| author |
Lee, C. Yu, D. Yu, A. Yan, L. Wang, H. Lau, J.H. |
| spellingShingle |
Lee, C. Yu, D. Yu, A. Yan, L. Wang, H. Lau, J.H. Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging |
| author_sort |
Lee, C. |
| title |
Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging |
| title_short |
Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging |
| title_full |
Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging |
| title_fullStr |
Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging |
| title_full_unstemmed |
Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging |
| title_sort |
bonding interface materials evolution of intermediate in/ag layers for low temperature fluxless solder based mems wafer level packaging |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/83520 |
| _version_ |
1781784363690622976 |