Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

• Main Authors: Lee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/83520
• Institution: National University of Singapore

10.1109/EMAP.2008.4784267