Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors

10.1109/IEDM.2011.6131681

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Bibliographic Details
Main Authors: Koh, S.-M., Zhou, Q., Thanigaivelan, T., Henry, T., Samudra, G.S., Yeo, Y.C.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84024
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-840242015-02-17T03:57:29Z Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors Koh, S.-M. Zhou, Q. Thanigaivelan, T. Henry, T. Samudra, G.S. Yeo, Y.C. ELECTRICAL & COMPUTER ENGINEERING 10.1109/IEDM.2011.6131681 Technical Digest - International Electron Devices Meeting, IEDM 35.7.1-35.7.4 TDIMD 2014-10-07T04:47:54Z 2014-10-07T04:47:54Z 2011 Conference Paper Koh, S.-M.,Zhou, Q.,Thanigaivelan, T.,Henry, T.,Samudra, G.S.,Yeo, Y.C. (2011). Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors. Technical Digest - International Electron Devices Meeting, IEDM : 35.7.1-35.7.4. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IEDM.2011.6131681" target="_blank">https://doi.org/10.1109/IEDM.2011.6131681</a> 9781457705052 01631918 http://scholarbank.nus.edu.sg/handle/10635/84024 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 10.1109/IEDM.2011.6131681
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Koh, S.-M.
Zhou, Q.
Thanigaivelan, T.
Henry, T.
Samudra, G.S.
Yeo, Y.C.
format Conference or Workshop Item
author Koh, S.-M.
Zhou, Q.
Thanigaivelan, T.
Henry, T.
Samudra, G.S.
Yeo, Y.C.
spellingShingle Koh, S.-M.
Zhou, Q.
Thanigaivelan, T.
Henry, T.
Samudra, G.S.
Yeo, Y.C.
Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
author_sort Koh, S.-M.
title Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
title_short Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
title_full Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
title_fullStr Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
title_full_unstemmed Novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
title_sort novel technique to engineer aluminum profile at nickel-silicide/silicon: carbon interface for contact resistance reduction, and integration in strained n-mosfets with silicon-carbon stressors
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/84024
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