Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2
10.1016/S0921-5107(00)00504-3
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sg-nus-scholar.10635-960282023-10-26T08:38:27Z Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 Lee, Y.K. Latt, K.M. JaeHyung, K. Osipowicz, T. Sher-Yi, C. Lee, K. PHYSICS 10.1016/S0921-5107(00)00504-3 Materials Science and Engineering B: Solid-State Materials for Advanced Technology 77 3 282-287 MSBTE 2014-10-16T09:18:39Z 2014-10-16T09:18:39Z 2000-09-29 Article Lee, Y.K., Latt, K.M., JaeHyung, K., Osipowicz, T., Sher-Yi, C., Lee, K. (2000-09-29). Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2. Materials Science and Engineering B: Solid-State Materials for Advanced Technology 77 (3) : 282-287. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5107(00)00504-3 09215107 http://scholarbank.nus.edu.sg/handle/10635/96028 000089670500012 Scopus |
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Singapore Singapore |
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10.1016/S0921-5107(00)00504-3 |
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PHYSICS |
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PHYSICS Lee, Y.K. Latt, K.M. JaeHyung, K. Osipowicz, T. Sher-Yi, C. Lee, K. |
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Article |
| author |
Lee, Y.K. Latt, K.M. JaeHyung, K. Osipowicz, T. Sher-Yi, C. Lee, K. |
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Lee, Y.K. Latt, K.M. JaeHyung, K. Osipowicz, T. Sher-Yi, C. Lee, K. Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 |
| author_sort |
Lee, Y.K. |
| title |
Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 |
| title_short |
Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 |
| title_full |
Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 |
| title_fullStr |
Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 |
| title_full_unstemmed |
Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 |
| title_sort |
comparative analysis and study of ionized metal plasma (imp)-cu and chemical vapor deposition (cvd)-cu on diffusion barrier properties of imp-tan on sio2 |
| publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/96028 |
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1781786373343150080 |