Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2
10.1016/S0921-5107(00)00504-3
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Main Authors: | Lee, Y.K., Latt, K.M., JaeHyung, K., Osipowicz, T., Sher-Yi, C., Lee, K. |
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Other Authors: | PHYSICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/96028 |
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Institution: | National University of Singapore |
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