Determination of the local electric field strength near electric breakdown

by Geinzer, T., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014

Determination of the local electric field strength by energy dispersive Photon Emission Microscopy

by Geinzer, T., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014

Correlation of scanning thermal microscopy and near-field cathodoluminescence analyses on a blue GaN light emitting device

by Heiderhoff, R., Palaniappan, M., Phang, J.C.H., Balk, L.J.
Published 2014

Characterization of electronic materials and devices by scanning near-field microscopy

by Balk, L.J., Heiderhoff, R., Phang, J.C.H., Thomas, Ch.
Published 2014

Characterization of interconnect defects using scanning thermal conductivity microscopy

by Ho, H.W., Phang, J.C.H., Altes, A., Balk, L.J.
Published 2014

Optical near-field probe with embedded gallium scattering center

by Isakov, D.V., Zhang, Y., Balk, L.J., Phang, J.C.H.
Published 2014

Electron beam induced temperature oscillation for qualitative thermal conductivity analysis by an SThM / ESEM-hybrid-system

by Tiedemann, A.-K., Heiderhoff, R., Balk, L.J., Phang, J.C.H.
Published 2014

Enhanced pixel by pixel emissivity correction for thermal microscopy

by Goh, S.H., Yim, K.H., Phang, J.C.H., Balk, L.J.
Published 2014

Investigation on the thermal distribution of nMOSFETs under different operation modes by scanning thermal microscopy

by Hendarto, E., Altes, A., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014

Reliable and accurate temperature measurement using scanning thermal microscopy with double lock-in amplification

by Ho, H.W., Zheng, X.H., Phang, J.C.H., Balk, L.J.
Published 2014

Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy

by Tiedemann, A.-K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014

Scanning near-field photon emission microscopy

by Isakov, D., Geinzer, T., Tio, A., Phang, J.C.H., Zhang, Y., Balk, L.J.
Published 2014

IBIC analysis of high-power devices

by Osipowicz, T., Zmeck, M., Watt, F., Fiege, G., Balk, L., Niedernostheide, F., Schulze, H.-J.
Published 2014

Applications of scanning Near-field photon emission microscopy

by Isakov, D., Tan, B., Phang, J., Yeo, Y., Tio, A., Zhang, Y., Geinzer, T., Balk, L.
Published 2014

Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)

by Fiege, G.B.M., Feige, V., Phang, J.C.H., Maywald, M., Görlich, S., Balk, L.J.
Published 2014

Analysis of high-power devices using proton beam induced currents

by Zmeck, M., Osipowicz, T., Watt, F., Niedernostheide, F., Schulze, H.-J., Fiege, G.B.M., Balk, L.
Published 2014

Near-field detection of photon emission from silicon with 30 nm spatial resolution

by Isakov, D., Tio, A.A.B., Geinzer, T., Phang, J.C.H., Zhang, Y., Balk, L.J.
Published 2014

Dedicated near-field microscopies for electronic materials and devices

by Balk, L.J., Cramer, R.M., Heiderhoff, R., Phang, J.Ch., Sergeev, O., Tiedemann, A.-K.
Published 2014

Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

by Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014

Front- and backside investigations of thermal and electronic properties of semiconducting devices

by Fiege, G.B.M., Schade, W., Palaniappan, M., Ng, V., Phang, J.C.H., Balk, L.J.
Published 2014