Design criteria assessment for ball grid array semiconductor packaging based on thermomechanical simulation and crack analysis
With notable advancements in the semiconductor devices, moving forward towards smaller and denser designs congruous with Moores Law, the semiconductor packages have to keep up with the significant changes in order to prevent the semiconductor chips from damages caused by both internal and external f...
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| Main Author: | |
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| Format: | text |
| Language: | English |
| Published: |
Animo Repository
2018
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| Subjects: | |
| Online Access: | https://animorepository.dlsu.edu.ph/etd_masteral/5441 |
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| Institution: | De La Salle University |
| Language: | English |