Simplified Assembly of Through-Silicon-Via Integrated Ion Traps

• المؤلفون الرئيسيون: Zhao, Peng, Li, Hong Yu, Likforman, Jean-Pierre, Henner, Theo, Lim, Yu Dian, Hu, Liang Xing, Seit, Wen Wei, Luca, Guidoni, Tan, Chuan Seng
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2023
• الموضوعات: Engineering::Electrical and electronic engineering::Microelectronics; Ceramic Pin Grid Array; Redistribution Layer; Surface Electrode Ion Trap; Through-Silicon Vias
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/170177

The scalability of surface electrode ion traps has been progressively improved with the on-chip integration of conventionally bulk components. Based on the development of through silicon via (TSV) integrated ion trap, in this work, we further simplify the back-end assembly process by patterning...