Electromigration behaviour of copper metal lines in ULSI devices

The present study focused on examining the failure mechanisms in both single-level and double-level Cu damascene structures for better understanding of the Cu electromigration behaviour.

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Bibliographic Details
Main Author:	Ong, Sock Meng.
Other Authors:	Park, Hun Sub
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	http://hdl.handle.net/10356/5097
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5097
record_format	dspace
spelling	sg-ntu-dr.10356-50972023-03-04T16:31:29Z Electromigration behaviour of copper metal lines in ULSI devices Ong, Sock Meng. Park, Hun Sub School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects The present study focused on examining the failure mechanisms in both single-level and double-level Cu damascene structures for better understanding of the Cu electromigration behaviour. Master of Engineering (SME) 2008-09-17T10:19:54Z 2008-09-17T10:19:54Z 2004 2004 Thesis http://hdl.handle.net/10356/5097 Nanyang Technological University 169 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Ong, Sock Meng. Electromigration behaviour of copper metal lines in ULSI devices
description	The present study focused on examining the failure mechanisms in both single-level and double-level Cu damascene structures for better understanding of the Cu electromigration behaviour.
author2	Park, Hun Sub
author_facet	Park, Hun Sub Ong, Sock Meng.
format	Theses and Dissertations
author	Ong, Sock Meng.
author_sort	Ong, Sock Meng.
title	Electromigration behaviour of copper metal lines in ULSI devices
title_short	Electromigration behaviour of copper metal lines in ULSI devices
title_full	Electromigration behaviour of copper metal lines in ULSI devices
title_fullStr	Electromigration behaviour of copper metal lines in ULSI devices
title_full_unstemmed	Electromigration behaviour of copper metal lines in ULSI devices
title_sort	electromigration behaviour of copper metal lines in ulsi devices
publishDate	2008
url	http://hdl.handle.net/10356/5097
_version_	1759857933814857728

Electromigration behaviour of copper metal lines in ULSI devices

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