Permanent polymer bonding for MEMS device fabrication and packaging applications

• Main Author: Lim, Eugene KaiSheng.
• Other Authors: Tan Chuan Seng
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/53124
• Institution: Nanyang Technological University

Permanent wafer bonding with polymers as intermediate adhesive layers plays an important role in fabrication for MEMS systems such as integrated circuits and packaging applications. Polymer adhesive wafer bonding has gained much interest due to its low cost, robust and simple fabrication pr...