Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience...
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| 格式: | Final Year Project |
| 語言: | English |
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2014
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| 在線閱讀: | http://hdl.handle.net/10356/55856 |
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