Hermetic Packaging of Sensor
Two types of bonding were investigated in this study, which consist of Cu-Cu fusion bonding use of Ar/N plasma activation and Au-Al Thermocompression bonding. Both bonding are direct metal to metal bonding. Cu-Cu fusion bonding use of Ar/N plasma activation is a derivative, directed to lower proces...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project |
| Language: | English |
| Published: |
2016
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/67766 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |