Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. Th...

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書目詳細資料
Main Authors:	Yap, Chin Chong, Brun, Christophe, Tan, Dunlin, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang
其他作者:	School of Electrical and Electronic Engineering
格式:	Article
語言:	English
出版:	2013
在線閱讀:	https://hdl.handle.net/10356/79979 http://hdl.handle.net/10220/9191
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University
語言:	English

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