Evaluation of the performance of TaN diffusion barrier against copper diffusion using SIMS and AFM

10.1049/el:20010390

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Bibliographic Details
Main Authors:	Teh, W.H., Koh, L.T., Chen, S.M., Xie, J., Li, C.Y., Foo, P.D.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/112967
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Institution:	National University of Singapore

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