Evaluation of the performance of TaN diffusion barrier against copper diffusion using SIMS and AFM
10.1049/el:20010390
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Main Authors: | Teh, W.H., Koh, L.T., Chen, S.M., Xie, J., Li, C.Y., Foo, P.D. |
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Other Authors: | INSTITUTE OF MICROELECTRONICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/112967 |
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Institution: | National University of Singapore |
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