Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

10.1063/1.4890960

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Main Authors:	Wang, D.D, Wang, W.L, Huang, M.Y, Lek, A, Lam, J, Mai, Z.H
Other Authors:	ELECTRICAL AND COMPUTER ENGINEERING
Format:	Article
Published:	2020
Subjects:	Fourier transform infrared spectroscopy Bonding characteristics Comparative studies Degradation behavior Line Edge Roughness Raman and FTIR spectroscopy Technology development Time-dependent dielectric breakdown Ultra-low-k dielectrics Dielectric materials
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/183712
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-1837122024-04-17T03:19:56Z Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study Wang, D.D Wang, W.L Huang, M.Y Lek, A Lam, J Mai, Z.H ELECTRICAL AND COMPUTER ENGINEERING Fourier transform infrared spectroscopy Bonding characteristics Comparative studies Degradation behavior Line Edge Roughness Raman and FTIR spectroscopy Technology development Time-dependent dielectric breakdown Ultra-low-k dielectrics Dielectric materials 10.1063/1.4890960 AIP Advances 4 7 77124 2020-11-19T07:17:40Z 2020-11-19T07:17:40Z 2014 Article Wang, D.D, Wang, W.L, Huang, M.Y, Lek, A, Lam, J, Mai, Z.H (2014). Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study. AIP Advances 4 (7) : 77124. ScholarBank@NUS Repository. https://doi.org/10.1063/1.4890960 21583226 https://scholarbank.nus.edu.sg/handle/10635/183712 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ Unpaywall 20201031
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Fourier transform infrared spectroscopy Bonding characteristics Comparative studies Degradation behavior Line Edge Roughness Raman and FTIR spectroscopy Technology development Time-dependent dielectric breakdown Ultra-low-k dielectrics Dielectric materials
spellingShingle	Fourier transform infrared spectroscopy Bonding characteristics Comparative studies Degradation behavior Line Edge Roughness Raman and FTIR spectroscopy Technology development Time-dependent dielectric breakdown Ultra-low-k dielectrics Dielectric materials Wang, D.D Wang, W.L Huang, M.Y Lek, A Lam, J Mai, Z.H Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
description	10.1063/1.4890960
author2	ELECTRICAL AND COMPUTER ENGINEERING
author_facet	ELECTRICAL AND COMPUTER ENGINEERING Wang, D.D Wang, W.L Huang, M.Y Lek, A Lam, J Mai, Z.H
format	Article
author	Wang, D.D Wang, W.L Huang, M.Y Lek, A Lam, J Mai, Z.H
author_sort	Wang, D.D
title	Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
title_short	Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
title_full	Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
title_fullStr	Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
title_full_unstemmed	Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
title_sort	failure mechanism analysis and process improvement on time-dependent dielectric breakdown of cu/ultra-low-k dielectric based on complementary raman and ftir spectroscopy study
publishDate	2020
url	https://scholarbank.nus.edu.sg/handle/10635/183712
_version_	1800914719532384256

Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

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