Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
10.1063/1.4890960
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Main Authors: | Wang, D.D, Wang, W.L, Huang, M.Y, Lek, A, Lam, J, Mai, Z.H |
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Other Authors: | ELECTRICAL AND COMPUTER ENGINEERING |
Format: | Article |
Published: |
2020
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Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/183712 |
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Institution: | National University of Singapore |
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