In situ measurement of wafer temperature using two sensors with different dynamical properties

In situ measurement of wafer temperature using two sensors with different dynamical properties

10.1088/0957-0233/17/11/014

Saved in:
Bibliographic Details
Main Authors: Tan, W.W., Tang, J.C., Loh, A.P., Tay, A.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
In situ temperature measurement
Post-exposure bake
Prediction
Online Access:http://scholarbank.nus.edu.sg/handle/10635/56297
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items

Similar Items