Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation

Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation

10.1016/j.ijmachtools.2006.02.016

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書目詳細資料
Main Authors:	Cai, M.B., Li, X.P., Rahman, M.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Ductile mode cutting Force Molecular Dynamics Silicon wafer Stress
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/61405
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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