Reliability improvement using buried capping layer in advanced interconnects

Annual Proceedings - Reliability Physics (Symposium)

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Bibliographic Details
Main Authors:	Yiang, K.Y., Mok, T.S., Yoo, W.J., Krishnamoorthy, A.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Conduction mechanism Dielectric breakdown Interconnects Low-k leakage current
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/71607
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-71607
record_format	dspace
spelling	sg-nus-scholar.10635-716072015-01-11T14:50:59Z Reliability improvement using buried capping layer in advanced interconnects Yiang, K.Y. Mok, T.S. Yoo, W.J. Krishnamoorthy, A. ELECTRICAL & COMPUTER ENGINEERING Conduction mechanism Dielectric breakdown Interconnects Low-k leakage current Annual Proceedings - Reliability Physics (Symposium) 333-337 ARLPB 2014-06-19T03:25:40Z 2014-06-19T03:25:40Z 2004 Conference Paper Yiang, K.Y.,Mok, T.S.,Yoo, W.J.,Krishnamoorthy, A. (2004). Reliability improvement using buried capping layer in advanced interconnects. Annual Proceedings - Reliability Physics (Symposium) : 333-337. ScholarBank@NUS Repository. 00999512 http://scholarbank.nus.edu.sg/handle/10635/71607 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Conduction mechanism Dielectric breakdown Interconnects Low-k leakage current
spellingShingle	Conduction mechanism Dielectric breakdown Interconnects Low-k leakage current Yiang, K.Y. Mok, T.S. Yoo, W.J. Krishnamoorthy, A. Reliability improvement using buried capping layer in advanced interconnects
description	Annual Proceedings - Reliability Physics (Symposium)
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Yiang, K.Y. Mok, T.S. Yoo, W.J. Krishnamoorthy, A.
format	Conference or Workshop Item
author	Yiang, K.Y. Mok, T.S. Yoo, W.J. Krishnamoorthy, A.
author_sort	Yiang, K.Y.
title	Reliability improvement using buried capping layer in advanced interconnects
title_short	Reliability improvement using buried capping layer in advanced interconnects
title_full	Reliability improvement using buried capping layer in advanced interconnects
title_fullStr	Reliability improvement using buried capping layer in advanced interconnects
title_full_unstemmed	Reliability improvement using buried capping layer in advanced interconnects
title_sort	reliability improvement using buried capping layer in advanced interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/71607
_version_	1681087414540435456

Reliability improvement using buried capping layer in advanced interconnects

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