Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Mahadevan, I.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73265
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Institution: National University of Singapore
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Summary:Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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