Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Mahadevan, I.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73265
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-732652015-01-12T04:15:16Z Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Mahadevan, I. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 209-214 2014-06-19T05:33:04Z 2014-06-19T05:33:04Z 2005 Conference Paper Liao, E.B.,Tay, A.A.O.,Ang, S.S.T.,Feng, H.H.,Nagarajan, R.,Kripesh, V.,Kumar, R.,Mahadevan, I. (2005). Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 209-214. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/73265 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Liao, E.B.
Tay, A.A.O.
Ang, S.S.T.
Feng, H.H.
Nagarajan, R.
Kripesh, V.
Kumar, R.
Mahadevan, I.
format Conference or Workshop Item
author Liao, E.B.
Tay, A.A.O.
Ang, S.S.T.
Feng, H.H.
Nagarajan, R.
Kripesh, V.
Kumar, R.
Mahadevan, I.
spellingShingle Liao, E.B.
Tay, A.A.O.
Ang, S.S.T.
Feng, H.H.
Nagarajan, R.
Kripesh, V.
Kumar, R.
Mahadevan, I.
Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
author_sort Liao, E.B.
title Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
title_short Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
title_full Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
title_fullStr Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
title_full_unstemmed Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
title_sort compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73265
_version_ 1681087716579606528

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