Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

• Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Mahadevan, I.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73265
• Institution: National University of Singapore

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005