Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon

Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon

Transactions of the North American Manufacturing Research Institute of SME

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Bibliographic Details
Main Authors: Arefin, S., Li, X.P., Rahman, M., He, T.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Cutting Edge Radius
Ductile Mode Cutting
Silicon Wafer
Subsurface Damage
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73579
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Institution: National University of Singapore

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