CMOS-based thermopiles using vertically integrated double polycrystalline silicon layers

10.1109/MEMSYS.2013.6474270

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Bibliographic Details
Main Authors: Zhou, H., Kropelnicki, P., Tsai, J.M., Lee, C.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83552
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Institution: National University of Singapore

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